Structural optimization design of LTCC substrate and their impacts on thermal performances of system-in-package

Microelectronics Reliability 2026

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Authors: Ge Shi, Zhong Jun Yu, Zheng Xu, Xing Yao Zeng, Yan Wei Dai, Fei Qin, H. Zhang
DOI: 10.1016/j.microrel.2025.115992
Cited by: 0
References: 19

Fields of Study & Subjects

Electrical and Thermal Properties of Materials Silicon Carbide Semiconductor Technologies 3D IC and TSV technologies

Publication details

Journal / source
Microelectronics Reliability
Volume
177
Pages
115992–115992
Publication date
5 January 2026
Language
EN