Study on the mechanism and growth behavior of copper micro-bump array interconnection via electroplating based on an accelerator–suppressor-leveler system

Microelectronics Reliability 2026

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Authors: Yixin Pan, Haoze Yang, Xiaokang Liu, Yuting Zhong, Junhui Li

DOI: 10.1016/j.microrel.2025.115994

Cited by: 0

References: 19

Fields of Study & Subjects

3D IC and TSV technologies Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability

References 19