Local stress distribution in sintered nanoporous silver films under mechanical and thermal loading

Microelectronics Reliability 2026

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Authors: Kokouvi Happy N'Tsouaglo, Loic Signor, Jérôme Colin, X. Milhet

DOI: 10.1016/j.microrel.2026.116009

Cited by: 2

References: 45

Fields of Study & Subjects

Nanoporous metals and alloys Electronic Packaging and Soldering Technologies Nanomaterials and Printing Technologies

References 45