Thermally cycling-stable and highly heat-dissipative BGA packages manufactured by fluxless laser soldering: Experimental and numerical investigations

Microelectronics Reliability 2026

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Authors: Dongjin Kim, Seonghui Han, Junha Baik, Junwoo Park, Ha-Young Yu, Kwansik Chung, E. S. Kim, Sehoon Yoo
DOI: 10.1016/j.microrel.2026.116018
Cited by: 1
References: 16

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Adhesion Friction and Surface Interactions 3D IC and TSV technologies

Publication details

Journal / source
Microelectronics Reliability
Publisher
Elsevier BV
Volume
178
Pages
116018–116018
Publication date
22 January 2026
Language
EN