Micro-scale fabrication and aging driven IMC evolution in SAC305/Sn-58Bi composite solder joints: A microstructural and mechanical correlation study

Microelectronics Reliability 2026

View at publisher

Authors: Dipayan Chakraborty, Nisar Ahamad Khan, Manish Kaushik, V Ravindra, Ajay Kumar

DOI: 10.1016/j.microrel.2026.116023

Cited by: 2

References: 23

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Nanomaterials and Printing Technologies

References 23