Analytical reliability performance maps for bond wire interfaces in power modules under cyclic thermomechanical loads

Microelectronics Reliability 2026 Open access

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Authors: Clément Chedozeau, Merouane Ouhab, Natasha Vermaak, Nicolas Degrenne, François Hild

DOI: 10.1016/j.microrel.2026.116027

Cited by: 1

References: 28

Fields of Study & Subjects

Silicon Carbide Semiconductor Technologies Electronic Packaging and Soldering Technologies High Temperature Alloys and Creep

References 28