Long-term drift of a bandgap voltage reference by molding compound oxidation during extended thermal aging
Fields of Study & Subjects
Semiconductor materials and devices
Silicon Carbide Semiconductor Technologies
Electronic Packaging and Soldering Technologies
Publication details
- Journal / source
- Microelectronics Reliability
- Publisher
- Elsevier BV
- Volume
- 179
- Pages
- 116043–116043
- Publication date
- 17 February 2026
- Language
- EN