Microstructural and reliability analysis of SAC305/Sn-57Bi-1Ag composite solder joints with different printing aspect ratios

Microelectronics Reliability 2026

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Authors: Taeyoon Im, Jahyeon Kim, Dongyurl Yu, Y. B. Park, Yong-Ho Ko

DOI: 10.1016/j.microrel.2026.116045

Cited by: 1

References: 29

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Electrical Contact Performance and Analysis 3D IC and TSV technologies

References 29