In-situ TEM investigation of thermomechanical fatigue of thick copper metallizations

Microelectronics Reliability 2026

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Authors: L. Karanja, S. Moser, M. Reisinger, M. Legros
DOI: 10.1016/j.microrel.2026.116050
Cited by: 1
References: 10

Fields of Study & Subjects

Microstructure and mechanical properties Magnetic Properties and Applications Metallic Glasses and Amorphous Alloys

Publication details

Journal / source
Microelectronics Reliability
Publisher
Elsevier BV
Volume
179
Pages
116050–116050
Publication date
11 February 2026
Language
EN