Thermo-mechanical reliability and scalability of copper-pillar solder-cap interconnects for micro-LEDs

Microelectronics Reliability 2026

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Authors: J. C. KIM, Ho-Jung Jeong, Dae‐Myeong Geum, Yong Suk Oh, Min-Su Park, Joonhyub Kim, Daewoong Jung, Chang-Mo Kang

DOI: 10.1016/j.microrel.2026.116051

Cited by: 0

References: 49

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Semiconductor Lasers and Optical Devices

References 49