Embedded PCB and DBC-integrated design of 650 V GaN power modules with enhanced thermal and electrical performance

Microelectronics Reliability 2026

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Authors: A Yeong Choi, Jaejin Jeon, Jae Hyuk Lim, Sang Won Yoon

DOI: 10.1016/j.microrel.2026.116053

Cited by: 0

References: 24

Fields of Study & Subjects

Silicon Carbide Semiconductor Technologies GaN-based semiconductor devices and materials Electronic Packaging and Soldering Technologies

References 24