Influence of cooling conditions on the estimated power cycling lifetime of a large-area substrate solder joint in power modules

Microelectronics Reliability 2026

View at publisher
Authors: N. Zöllner, O. Schilling, David Übelacker
DOI: 10.1016/j.microrel.2026.116055
Cited by: 0
References: 2

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Silicon Carbide Semiconductor Technologies Reliability and Maintenance Optimization

Publication details

Journal / source
Microelectronics Reliability
Volume
179
Pages
116055–116055
Publication date
13 February 2026
Language
EN