Impacts and mitigation strategies of process-induced packaging defects for enhancing reliability of power devices

Microelectronics Reliability 2026

View at publisher

Authors: Waseem Abbas, Mesfin Seid Ibrahim, Chang Bo Lu, Yuluo Hou, Hiu Hung Lee, Adil Zulfiqar, KH Loo

DOI: 10.1016/j.microrel.2026.116056

Cited by: 1

References: 49

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability Silicon Carbide Semiconductor Technologies

References 49