Characterization of the bulk moisture diffusion in epoxy-based potting compounds for IGBT semiconductor power modules

Microelectronics Reliability 2026

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Authors: Ariane Tomas, Loïc Théolier, Alexandrine Guédon-Gracia, H. Frémont, P. Pichon

DOI: 10.1016/j.microrel.2026.116057

Cited by: 0

Fields of Study & Subjects

Phase Change Materials Research Thermal properties of materials Silicon Carbide Semiconductor Technologies