Improved metallization performance of glass substrates using glass-copper composite interlayer

Microelectronics Reliability 2026

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Authors: Kefu Zeng, Guannan Yang, Zehua Tang, Zebin Xue, Yu Zhang, Guanghan Huang, Chengqiang Cui
DOI: 10.1016/j.microrel.2026.116071
Cited by: 1
References: 43

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Nanomaterials and Printing Technologies

Publication details

Journal / source
Microelectronics Reliability
Publisher
Elsevier BV
Volume
179
Pages
116071–116071
Publication date
18 February 2026
Language
EN