Pressureless silver paste low-temperature sintering behavior and reliability analysis for large-size (≥100 mm2) chip interconnection in power devices

Microelectronics Reliability 2026

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Authors: Jinze Du, Limin Ma, Qiang Jia, Y. Wang, Hongqiang Zhang, Fu Guo

DOI: 10.1016/j.microrel.2026.116075

Cited by: 3

References: 35

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability 3D IC and TSV technologies

References 35