Long term transformation of Cu / Sn intermetallic compounds in large solder joints

Microelectronics Reliability 2026 Open access

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Authors: Peter Dreher, Marcel Sippel, Johannes Seltsam, David Sopp

DOI: 10.1016/j.microrel.2026.116082

Cited by: 0

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Nanomaterials and Printing Technologies Metallurgical and Alloy Processes