Three-point bending stress analysis and decision tree prediction for QFN solder joints using SnBiInZn high-entropy alloy solder

Microelectronics Reliability 2026

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Authors: Gui Wang, Chunyue Huang, Dian Chen, Jingcheng Mo, Chao Gao

DOI: 10.1016/j.microrel.2026.116084

Cited by: 2

References: 29

Fields of Study & Subjects

High Entropy Alloys Studies Metal and Thin Film Mechanics Additive Manufacturing Materials and Processes

References 29