Formation of highly conductive copper films from oxide-based nanoparticle inks via intense pulsed light sintering
Fields of Study & Subjects
Nanomaterials and Printing Technologies
Advanced Sensor and Energy Harvesting Materials
Electronic Packaging and Soldering Technologies
Publication details
- Journal / source
- Microelectronics Reliability
- Publisher
- Elsevier BV
- Volume
- 180
- Pages
- 116085–116085
- Publication date
- 4 March 2026
- Language
- EN