Influence of via structures on PCB warpage during manufacturing processes

Microelectronics Reliability 2026

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Authors: Mengxuan Cheng, Yong Jiang, Guoxiang Miao, Zhiyan Zhao, Hao Zheng (352272), Yuxi Jia
DOI: 10.1016/j.microrel.2026.116086
Cited by: 2
References: 28

Fields of Study & Subjects

Metallurgical and Alloy Processes Electronic Packaging and Soldering Technologies Injection Molding Process and Properties

Publication details

Journal / source
Microelectronics Reliability
Publisher
Elsevier BV
Volume
180
Pages
116086–116086
Publication date
4 March 2026
Language
EN