Cu-Cu low temperature bonding based on graphene-coated Cu foam/SAC solder composite interlayer

Microelectronics Reliability 2026

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Authors: Wenhua Yang, Zhenling Tan, Siyu Zhang, Ruihong Tang, Chao Xie, Zhixiang Huang

DOI: 10.1016/j.microrel.2026.116090

Cited by: 3

References: 21

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Aluminum Alloys Composites Properties

References 21