Microstructural evolution and mechanical performance of transient liquid phase bonded Ni/Cu foam (Sn-infiltrated)/Ni joints

Microelectronics Reliability 2026

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Authors: Zhen Pan, Zhihui Wang, Chaohan Deng, Xiangyu Lian, Hongmei Chi

DOI: 10.1016/j.microrel.2026.116122

Cited by: 1

References: 31

Fields of Study & Subjects

Cellular and Composite Structures Shape Memory Alloy Transformations Electronic Packaging and Soldering Technologies

References 31