Synergistic effects of In and Sb additions on the microstructure, thermal behavior and mechanical properties of SAC305 solder alloys

Microelectronics Reliability 2026

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Authors: Phairote Sungkhaphaitoon, Chatree Homkhiew, Suchart Chantaramanee
DOI: 10.1016/j.microrel.2026.116175
Cited by: 1
References: 47

Fields of Study & Subjects

Metallurgical and Alloy Processes Electronic Packaging and Soldering Technologies Microstructure and mechanical properties

Publication details

Journal / source
Microelectronics Reliability
Publisher
Elsevier BV
Volume
182
Pages
116175–116175
Publication date
19 May 2026
Language
EN