Thermal-mechanical reliability enhancement of thermal interface material in lidded FCBGA packaging via SVR-based coverage degradation prediction

Microelectronics Reliability 2026

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Authors: Wei Du, Xueliang Wang, Xuyang Yan, Wenyu Li, Linfeng Cai, Ganwei Yang, Zhida Wang, Zhuqiu Wang, Jiajie Fan

DOI: 10.1016/j.microrel.2026.116180

Cited by: 1

References: 17

Fields of Study & Subjects

3D IC and TSV technologies Thermal properties of materials Silicon Carbide Semiconductor Technologies

References 17