Improving TDDB lifetime of MIM capacitor by optimized electrode etching process

Microelectronics Reliability 2026

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Authors: Dong Pan, Ruizhang Xu

DOI: 10.1016/j.microrel.2026.116229

Cited by: 1

References: 9

Fields of Study & Subjects

Copper Interconnects and Reliability Semiconductor materials and devices Advancements in Semiconductor Devices and Circuit Design

References 9