Revealing thermo-mechanical degradation mechanism of sintered silver nanoparticles under thermal shock via microstructure characterization and kinetic Monte Carlo simulation

Materials Science and Engineering A 2026

View at publisher

Authors: Chao Gu, Xiao Hu, Kai Lu, Tao Wang, Xuyang Yan, Wei Chen, Junwei Chen, Xuejun Fan, Guoqi Zhang, J. Fan

DOI: 10.1016/j.msea.2025.149646

Cited by: 3

References: 41

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Thermal and Kinetic Analysis Thermal properties of materials

References 41