Towards power device packaging: Development of Cu-Au 10min direct bonding to replace sintered Ag paste using high interface density surface activation layers

Materials Science and Engineering A 2026

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Authors: Ze-Hao Zhao, Wei Wu, Ming Liang, J. C. Liu, Li-Yin Gao, Hao Chi Zhang, Zhi-Quan Liu

DOI: 10.1016/j.msea.2026.149812

Cited by: 1

References: 30

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Copper Interconnects and Reliability

References 30