High-performance soldering achieved through an energy-efficient magnetic field-assisted microwave hybrid joining: A multiscale study via molecular dynamics and first-principles calculations

Materials Science and Engineering A 2026

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Authors: Shuai Zhang, Shuai Zhang, Chen Zeng, Zhehao Gan, Jianxing Liu, Peng He, Tianran Ding, Weimin Long, Sujuan Zhong, Yew-Hoong Wong, Shuye Zhang, Shuye Zhang
DOI: 10.1016/j.msea.2026.149915
Cited by: 1
References: 42

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Microwave-Assisted Synthesis and Applications Electromagnetic wave absorption materials

Publication details

Journal / source
Materials Science and Engineering A
Publisher
Elsevier BV
Volume
956
Pages
149915–149915
Publication date
12 February 2026
Language
EN