Barrier effect of Sn-Bi-In multi-principal element solder on thermomigration

Materials Science and Engineering A 2026

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Authors: Yifan Yao, Xingchao Mao, A.M. Gusak, Lulin Xie, Yuanxing Duan, Qinglei Sun, Angmin Li, Junlei Qi, Wenbin Wang, Qiyuan He, Yingxia Liu

DOI: 10.1016/j.msea.2026.149916

Cited by: 1

References: 58

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Metallurgical and Alloy Processes Nanomaterials and Printing Technologies

References 58