Strength improvement and ductility preservation of Sn-Ag-Cu solder alloy induced by Bi and Mn microalloying

Materials Science and Engineering A 2026

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Authors: Jianchao Liang, Ruyu Tian, Wei Wang, Shang Wang, Jiayun Feng, Shuai Wang, Minghan Yu, Peng Wu, Tao Deng, Yanhong Tian

DOI: 10.1016/j.msea.2026.150010

Cited by: 3

References: 27

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Metallurgical and Alloy Processes Advanced Welding Techniques Analysis

References 27