Electro-recrystallization in cold-rolled pure copper: Mechanisms and correlations among microstructure, texture, crystallinity, micro-hardness, and electrical resistivity

Materials Science and Engineering A 2026

View at publisher

Authors: Hsuan-Cheng Huang, Meng-Chun Chiu, Yi-Chen Keng, Chien-Lung Liang

DOI: 10.1016/j.msea.2026.150343

Cited by: 1

References: 101

Fields of Study & Subjects

Microstructure and mechanical properties Electromagnetic Effects on Materials Electrodeposition and Electroless Coatings

References 101