The synergistic enhancement mechanism of strength and electrical conductivity for Cu-Ti alloys processing by mechanical vibration-assisted solidification and cryorolling

Materials Science and Engineering A 2026

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Authors: Nanxi Gao, Juntao Zou, Z ZHANG, Jian Liu, Menghao Bian, Zihan Wang, Yuxin Zhang, Lijiao Yin, Wen Wang, Kuaishe Wang

DOI: 10.1016/j.msea.2026.150456

Cited by: 1

References: 36

Fields of Study & Subjects

Microstructure and mechanical properties Solidification and crystal growth phenomena Aluminum Alloy Microstructure Properties

References 36