Room-temperature direct bonding of yttria-stabilized zirconia to silicon wafer via surface activation for advanced heterointegration

Materials Science in Semiconductor Processing 2026

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Authors: Xinlong Zhao, Yongfeng Qu, Song Yang, Ningkang Deng, Jin Yuan, Wenbo Hu, Zhaoyang Zhang, H. J. Wang

DOI: 10.1016/j.mssp.2026.110450

Cited by: 0

References: 43

Fields of Study & Subjects

3D IC and TSV technologies Semiconductor materials and devices Electronic and Structural Properties of Oxides

References 43