Reliability design of power modules: multi time sequence simulation of soldering warpage deformation and fatigue life prediction of solder layers

Materials Science in Semiconductor Processing 2026

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Authors: Sheng Bi, Dao‐Hang Li, Can-Pu Wang, Zemin Bu, Yun-Hui Mei

DOI: 10.1016/j.mssp.2026.110474

Cited by: 0

References: 26

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Fatigue and fracture mechanics Mechanical Behavior of Composites

References 26