Indirect impact of interfacial reaction on coarsening behavior of low-temperature dual-phase solder joints: A theoretical and experimental investigation

Materials Science in Semiconductor Processing 2026

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Authors: Yichun Lin, Fei Hu, Wangyun Li, Wu YUE

DOI: 10.1016/j.mssp.2026.110511

Cited by: 0

References: 66

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Metallurgical and Alloy Processes Solidification and crystal growth phenomena

References 66