Contrasting effects of silver hillocks and copper diffusion on Ag sinter bonding in direct-cooled SiC power semiconductor modules

Materials Science in Semiconductor Processing 2026

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Authors: YehRi Kim, Tae-Ik Lee, Dongjin KiM

DOI: 10.1016/j.mssp.2026.110513

Cited by: 5

References: 11

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Silicon Carbide Semiconductor Technologies Advanced ceramic materials synthesis

References 11