Revisiting the computation of Vacancy Formation Energy using first-principles density functional theory calculations for VLSI Interconnection reliability
Fields of Study & Subjects
Copper Interconnects and Reliability
Electronic Packaging and Soldering Technologies
Silicon and Solar Cell Technologies
Publication details
- Journal / source
- Materials Science in Semiconductor Processing
- Publisher
- Elsevier BV
- Volume
- 208
- Pages
- 110516–110516
- Publication date
- 9 February 2026
- Language
- EN