Low subsurface damage slicing of 4H-SiC by a phase-modulated picosecond laser

Materials Science in Semiconductor Processing 2026

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Authors: Chengrui Tian, Mengda Wang, Yunzheng Wang, Changbao Ma, Xian Zhao, Yan Li

DOI: 10.1016/j.mssp.2026.110546

Cited by: 1

References: 33

Fields of Study & Subjects

Advanced Surface Polishing Techniques Silicon Carbide Semiconductor Technologies Laser Material Processing Techniques

References 33