A theoretical solution for a novel load-on-elastic-foundation (LoEF) uniaxial bending test and its application to strength evaluation of thin silicon dies

Materials Science in Semiconductor Processing 2026

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Authors: P.J. Hsieh, Μ. Y. Tsai

DOI: 10.1016/j.mssp.2026.110556

Cited by: 0

References: 19

Fields of Study & Subjects

Metal and Thin Film Mechanics Electronic Packaging and Soldering Technologies Advanced MEMS and NEMS Technologies

References 19