Low-temperature Cu-Cu bonding enabled by a simulated interface approach: process optimization and interfacial mechanisms of Ar plasma activation and glycine wet treatment

Materials Science in Semiconductor Processing 2026

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Authors: Gui Chen, Yun-Hao Shao, Wen Zhu, Xin-Ping Qu

DOI: 10.1016/j.mssp.2026.110566

Cited by: 2

References: 37

Fields of Study & Subjects

3D IC and TSV technologies Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability

References 37