Surface and subsurface damage suppression in ultrasonic vibration assisted machining of hard and brittle materials: a review

Materials Science in Semiconductor Processing 2026

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Authors: Tongsheng Zhou, Ying Niu, Zhipeng Sun, Jingjing Niu, Feng Jiao

DOI: 10.1016/j.mssp.2026.110628

Cited by: 3

References: 135

Fields of Study & Subjects

Advanced machining processes and optimization Advanced Machining and Optimization Techniques Advanced Surface Polishing Techniques

References 135