Effect of Bi, Ni and Sb for comprehensive improvement on Sn-Ag-Cu solder alloys: A review

Materials Science in Semiconductor Processing 2026

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Authors: Zezheng Li, Fengjiang Wang

DOI: 10.1016/j.mssp.2026.110731

Cited by: 4

References: 133

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Metallurgical and Alloy Processes Electrical Contact Performance and Analysis

References 133