Advances in copper pillar bumps for high-density electronic packaging

Materials Science in Semiconductor Processing 2026

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Authors: Gaohui Xu, Lele Yang, 丁苏, Jiefei Gu, Lei Su, Wanli Li, Ke Li

DOI: 10.1016/j.mssp.2026.110744

Cited by: 1

References: 70

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Nanomaterials and Printing Technologies

References 70