Advances on the application of ceria nanoparticles in dielectric layer CMP and post-cleaning: structural control, modification strategies, and mechanistic studies

Materials Science in Semiconductor Processing 2026

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Authors: Wenyue QI, Jiaji Geng, Baimei Tan, Fangyuan Wang, Xinyu Zhao, Jiadong Zhao

DOI: 10.1016/j.mssp.2026.110767

Cited by: 1

References: 112

Fields of Study & Subjects

Advanced Surface Polishing Techniques Erosion and Abrasive Machining Mineral Processing and Grinding

References 112