Degradation mechanisms and microstructure evolution of TGV-Cu vertical interconnects in glass wafer under high-temperature aging

Materials Science in Semiconductor Processing 2026

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Authors: Guoli Sun, Jinhong Liu, Jingyi Zhao, Jialin Zhang, Jialin Zhang, Zhaoyu Li, Shuye Zhang

DOI: 10.1016/j.mssp.2026.110777

Cited by: 1

References: 45

Fields of Study & Subjects

Copper Interconnects and Reliability 3D IC and TSV technologies Electronic Packaging and Soldering Technologies

References 45