Engineering through-glass via morphology in fused silica by bessel-beam focus offset

Materials Science in Semiconductor Processing 2026

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Authors: Qichang An, Shanjun Ding, Shucun Huo, Li M, Zeheng Yang, Xingjian Jiang, Zhongyao Yu, Zhidan Fang, Xiaomeng Wu, Qidong Wang

DOI: 10.1016/j.mssp.2026.110804

Cited by: 1

References: 17

Fields of Study & Subjects

Laser Material Processing Techniques 3D IC and TSV technologies Silicon Nanostructures and Photoluminescence

References 17