Enhanced thermal stability of direct cooling heatsink bonding for power electronics using instantaneous laser soldering: Experimental, FEM, and CFD investigation

Materials Science in Semiconductor Processing 2026

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Authors: Ha-Young Yu, Byeongchan Kim, YehRi Kim, Junwoo Park, Shin‐Il Kim, Tae-Ik Lee, Myoung‐Gyu Lee, Dongjin Kim

DOI: 10.1016/j.mssp.2026.110863

Cited by: 1

References: 29

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Optical properties and cooling technologies in crystalline materials

References 29