Automated platform for developing wet-etching processes of materials
Fields of Study & Subjects
Copper Interconnects and Reliability
Machine Learning in Materials Science
Block Copolymer Self-Assembly
Publication details
- Journal / source
- Materials Science in Semiconductor Processing
- Publisher
- Elsevier BV
- Volume
- 214
- Pages
- 110933–110933
- Publication date
- 27 June 2026
- Language
- EN