Rate- and temperature-dependent viscoplastic behavior and microstructural evolution of Sn3.0Ag0.5Cu-xBi low-melting-point lead-free solder alloys

Materials Today Communications 2026 Open access

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Authors: Yuhong Ma, Xuexia Yang, Erqiang Liu, Gesheng Xiao, Xuefeng Shu

DOI: 10.1016/j.mtcomm.2026.114667

Cited by: 0

References: 41

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Metallurgical and Alloy Processes Welding Techniques and Residual Stresses

References 41