Process optimization of a novel high heat-resistant bisphenol-A novolac epoxy resin reinforced with nano-particles

This study develops a novel epoxy nanocomposite material with enhanced thermal resistance. Unlike conventional bisphenol-A epoxy systems cured with amine hardeners, this research employs bisphenol-A novolac epoxy resin and methyl hexahydrophthalic anhydride hardener to prepare the polymer matrix. Three types of inorganic nanoparticles were incorporated as reinforcements, and the Taguchi method with analysis of variance (ANOVA) was utilized to identify significant factors affecting the thermal properties of the epoxy matrix and optimize the process. The interaction effects among control factors to determine the optimal composition for maximizing thermal resistance of the composite were also explored. The results reveal that the formulated nanocomposites significantly outperform traditional bisphenol-based epoxies in terms of thermal decomposition temperature and heat resistance index. Specifically, the optimal formulation containing 2 wt% Al 2 O 3 , 2 wt% SiO 2 , and 2 wt% carbon black achieved a thermal decomposition temperature (T 5 ) of 389.04 °C. Poor heat resistance of electric packaging materials will cause AI or automation system chips to fail due to high temperature, resulting in errors. The prepared materials can be used in electronic and mechanical related fields.